Compound Semiconductor Foundry Market Report 2025

On Aug 19, the latest report "Global Compound Semiconductor Foundry Market 2025 by Manufacturers, Regions, Types and Applications, Forecast to 2031" from Global Info Research provides a detailed and comprehensive analysis of the global Compound Semiconductor Foundry market. The report provides both quantitative and qualitative analysis by manufacturers, regions and countries, types and applications. As the market is constantly changing, this report explores market competition, supply and demand trends, and key factors that are causing many market demand changes. The report also provides company profiles and product examples of some of the competitors, as well as market share estimates for some of the leading players in 2025.

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According to our (Global Info Research) latest study, the global Compound Semiconductor Foundry market size was valued at US$ 1226 million in 2024 and is forecast to a readjusted size of USD 2309 million by 2031 with a CAGR of 9.6% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
This report studies the compound semiconductor foundry, includes wafer foundry for Silicon carbide (SiC), Gallium Nitride (GaN) and GaAs Wafer Foundry.
In SiC foundry segment, currently only few fabs can provide the SiC wafer foundry, include X-Fab, Episil Technology Inc., Sanan IC and HLMC, etc.
In GaN foundry, which includes the GaN-on-Si Wafers and GaN-on Si Wafers, key players include TSMC, GlobalFoundries, UMC, VIS, WIN Semiconductors Corp., Episil Technology Inc., UMS RF and Sanan IC.
In GaAs Foundry, key players include WIN Semiconductors Corp., AWSC, GCS (Global Communication Semiconductors), Wavetek, Chengdu Hiwafer Semiconductor, Sanan IC, MACOM, etc.
This report is a detailed and comprehensive analysis for global Compound Semiconductor Foundry market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Technology and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.



This report also provides key insights about market drivers, restraints, opportunities, new product launches or approval.
Compound Semiconductor Foundry market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type: SiC Wafer Foundry、 GaN Wafer Foundry、 GaAs Wafer Foundry
Market segment by Application: Automotive & EV/HEV、 Consumer Electronics、 RF Application、 Others
Major players covered: TSMC、 GlobalFoundries、 United Microelectronics Corporation (UMC)、 VIS (Vanguard International Semiconductor)、 X-Fab、 WIN Semiconductors Corp.、 Episil Technology Inc.、 Chengdu Hiwafer Semiconductor、 UMS RF、 Sanan IC、 AWSC、 GCS (Global Communication Semiconductors)、 MACOM、 Chengdu Hiwafer Semiconductor、 Wavetek、 BAE Systems、 HLMC、 GTA Semiconductor Co., Ltd.、 Beijing Yandong Microelectronics、 United Nova Technology

The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Compound Semiconductor Foundry product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Compound Semiconductor Foundry, with price, sales quantity, revenue, and global market share of Compound Semiconductor Foundry from 2020 to 2025.
Chapter 3, the Compound Semiconductor Foundry competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Compound Semiconductor Foundry breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment Compound Semiconductor Foundry the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the Compound Semiconductor Foundry sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2024.and Compound Semiconductor Foundry market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Compound Semiconductor Foundry.
Chapter 14 and 15, to describe Compound Semiconductor Foundry sales channel, distributors, customers, research findings and conclusion.

The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Compound Semiconductor Foundry
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace

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